Termiskā pasta Iceberg ICEBERG THERMAL FUZEIce 7g

Thermal paste Iceberg THERMAL FUZEIce – Performance and reliability in cooling. Iceberg Thermal FUZEIce thermal paste is an excellent solution for computer enthusiasts looking for a high-performance product for effective heat dissipation. Thanks to its innovative formula, this paste ensures reliable efficiency, which translates into better stability and longer lifespan of computer components. High thermal conductivity 11.25 W/m·K One of the most important advantages of FUZEIce paste is its excellent thermal conductivity of 11.25 W/m·K. This parameter ensures efficient heat transfer from the processor or graphics card to the heatsink, which is crucial for maintaining optimal operating temperature. Ease of application thanks to a precise applicator The paste has been designed for ease of use. Equipped with a precise applicator and an angled spreader, it allows for even distribution of the paste layer, which minimizes the risk of mess and ensures maximum heat transfer efficiency. Resistance to high temperatures up to 200°C FUZEIce is characterized by a wide operating temperature range from -50 to 200 °C. This makes the paste resistant to extreme conditions, ensuring long-term and reliable operation in various applications. Ideal for processors and graphics cards Iceberg Thermal FUZEIce thermal paste is an excellent choice for users who need an effective cooling solution for processors (CPU) and graphics cards (GPU). Thanks to its properties, higher clock speeds can be achieved, which translates into better system performance. Technical specifications of Iceberg THERMAL FUZEIce thermal paste Type Thermal paste Thermal conductivity 11.25 W/m·K Density 2.6 g/cm³ Weight 7 g Quantity in package 1 pc. Operating temperature (T-T) -50 - 200 °C Product color Green Viscosity 56000 poise Order now to enjoy the best cooling performance! Ideal for your hardware – available today at Morele!